Myself (fifth from left) with a few memebrs of Institute for MicroSystem Integration (IMSI) Consortium in 2006 at the University of Tokyo



Me (middle), Mr. Kouzima and Mr. Miyamoto (president) from Musashino Engineering Co. Ltd. Japan


Myself with Engineers from Nihon Shinko Seiki and Bondtech Corporation, Japan after inspection of Plasma Surface Activated Bonder



Mr. Jeogi Kagami from Nihon Sinko Seiki, Mr. Akira Yamauchi, president of Bondtech Corp.. Japan, Mrs. Fangfang Zhang, Myself and Dr. Ognian Marinov
in Indian Garden to celebrate successful installation of the Plasma Surface Activated Bonder at McMaster University.